Includes NVMe support in rear for caching layer, 1xM.2 via interposer connection, variety of storage mezzanine cards, while supporting up to 4TB of DDR4 memory, and 4xPCIe slots with riser cards and 1xPCIe x16 lanes for OCP 3.0
By StorageNewsletter.com
Inventec Group has introduced a high density storage serve,r Steelix.
This server provides computing performance with a single socket solution that supports the 3rd Gen AMD EPYC processor.
“Steelix is an ideal hybrid system for warm storage and is applicable to further storage applications. By optimizing the ratio of SSDs and HDDs, it can highly accelerate IO/s and throughput performance while offering excellent storage capacity. Steelix can provide a higher virtualized workload and adapt quickly to changing business computing needs,” said George Lin, GM,business unit VI, Inventec Enterprise Business Group.
Steelix appliance front and rear
Highlight of Steelix:
- Enhanced performance with single socket solution
- Advanced security
- 2U form factor
- Supports 24xLFF HDD bays
- Flexible and scalable I/O options
- Optimized serviceability
Enhanced performance and security
With TDP of up to 280W, Steelix provides performance with up to 64 cores, 128 lane of PCIe Gen4 connectivity, and up to 4TB of memory across 16 DIMM slots. The server also possesses up to 32MB of L3 cache per eight cores, supporting heavy workloads.
At the same time, Steelix helps minimize potential attack surfaces and protect software and data through the AMD Infinity Guard features, including Secure Memory Encryption which helps secure the boot process and encrypts the entire main memory, and Secure Encrypted Virtualization) which helps secure virtualized and container environments.
High-density with scalability
Te company offers a range of hot-pluggable hybrid flash options within the 2U form factor. The server’s 24 LFF HDD bays and 4 rear side SSD bays provides multiple storage options for increased flexibility and scalability. The storage unit also includes NVMe support in the rear for a caching layer, 1xM.2 via interposer connection, and a variety of storage mezzanine cards, while supporting up to 4TB of DDR4 memory.
Hosting 4xPCIe slots with riser cards and one PCIe x16 lanes for OCP 3.0, it is a hybrid system for warm storage and applicable for various storage applications.
Increased flexibility and optimized servibility
Understanding that each user has different needs, the firm is created to be adaptable to various scenarios. For example, it offers an OCP NIC mezzanine option, ranging from 10bEt to 100GbE to allow high-speed performance and I/O flexibility.
At the same time, the storage server possesses a hot-swappable fan module with serviceability in a simple 2U enclosure which includes:
- PSU with 1+1 redundancy
- 24×3.5″ HDD in the front HDD Tray
- 4xrear 2.5″ SSD
- 5×6056 hot-swap fan
